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Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography

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3 Author(s)
Rooks, S.M. ; Dept. of Mech. Eng., Toronto Univ., Ont., Canada ; Benhabib, B. ; Smith, K.C.

An inspection process based on scanned-beam X-ray laminography (SBXLAM) is proposed herein for quantitatively monitoring the quality of ball-grid-array (BGA) joints. The long-term reliability of the BGA joints depends on the component-assembly process producing joints with sufficient solder volume and proper alignment. Inspection algorithms were developed to measure the critical BGA-joint characteristics, including the alignment between the ball and the PCB pad, the solder thickness, and the average joint-diameter, and thus, determine whether the joints are defective. The performance of the inspection algorithms was evaluated by inspecting samples with defects that were independently verified

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 4 )

Date of Publication:

Dec 1995

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