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A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials

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5 Author(s)
Kehoe, L. ; Nat. Microelectron. Res. Centre, Cork, Ireland ; Kelly, P.V. ; O'Connor, G.M. ; O'Reilly, M.
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Alumina derivative ceramics and low temperature co-fired ceramic (LTCC) electronic multichip module (MCM) packaging substrates have been characterized using single- and double-sided inspection laser flash thermal diffusivity measurement techniques. The paper highlights problems associated with both the measurement system and associated data analysis for the single-sided measurement, and these data are evaluated with reference to that measured by an existing (double sided inspection) standard laser flash method. Finally, a preliminary single-sided measurement methodology is proposed.

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 4 )