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An assessment of the thermal performance of the PBGA family

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3 Author(s)
Mulgaonker, S. ; Adv. Interconnect Syst. Lab., Motorola Inc., Tempe, AZ, USA ; Chambers, B. ; Mahalingam, M.

The plastic ball grid array (PBGA) has generated significant interest as a cost effective packaging alternative for high I/O ULSI devices. This study assesses thermal performance of the PBGA family using the metric of power dissipation capability-“power rating” for IC packages. The metric chosen is the power dissipated for constraints of junction temperature (<105°C), and board temperature (<90°C), in low aspect ratio enclosures (portable products), as well as natural and forced air convection (~1.0 m/s) equipment operating conditions. The free and forced air conditions are typical of PC/workstation environments. Simulation studies using a finite difference based software for thermal performance of IC packages investigated the relative roles of package enhancements toward the thermal performance. Experimental data for the 106 PBGA in free air and portable radio mockup, and the 119 PBGA in free and forced air were used to validate the methodology. The study covers 68-324 pincount PBGAs and compares the performance with comparable pincount PQFPs (plastic quad hat package) and other contemporary package styles. The study also addresses system level enhancements for extending the thermal performance of PBGAs for applications

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 4 )