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This paper addresses the problem of scaling interconnects to nanometric dimensions in future very-large-scale integration applications. Traditional copper interconnects are compared to innovative interconnects made by bundles of metallic carbon nanotubes. A new model is presented to describe the propagation of electric signals along carbon nanotube (CNT) bundles, in the framework of the classical transmission line theory. A possible implementation of a future scaled microstrip based on CNT bundle is analyzed and compared to a conventional microstrip.