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Multiscale 3D thermal analysis of analog ICs: From full-chip to device level

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4 Author(s)
Turowski, M. ; CFD Res. Corp., Huntsville, AL ; Dooley, S. ; Raman, A. ; Casto, M.

We have developed and employed an automated multi-scale modeling approach to investigate thermal issues in analog integrated circuits (ICs) and to enable ldquothermally awarerdquo design thereof. Thermal analysis from full-chip scale down to the single transistor level was made possible with this approach utilizing the finite volume three-dimensional (3D) numerical technique. We have developed new methods and tools that import GDSII layout of entire IC and generate 3D model. The tool provides a 3D temperature map that can show thermal gradients across a chip, as well as local temperature distribution (hot spots) down to single transistor level. This allows introducing temperature back into design process. Our method and tools are demonstrated on a couple of radio-frequency (RF) chips. The multiscale modeling has been verified with infrared temperature measurements.

Published in:

Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on

Date of Conference:

24-26 Sept. 2008

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