Cart (Loading....) | Create Account
Close category search window

Multiscale 3D thermal analysis of analog ICs: From full-chip to device level

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Turowski, M. ; CFD Res. Corp., Huntsville, AL ; Dooley, S. ; Raman, A. ; Casto, M.

We have developed and employed an automated multi-scale modeling approach to investigate thermal issues in analog integrated circuits (ICs) and to enable ldquothermally awarerdquo design thereof. Thermal analysis from full-chip scale down to the single transistor level was made possible with this approach utilizing the finite volume three-dimensional (3D) numerical technique. We have developed new methods and tools that import GDSII layout of entire IC and generate 3D model. The tool provides a 3D temperature map that can show thermal gradients across a chip, as well as local temperature distribution (hot spots) down to single transistor level. This allows introducing temperature back into design process. Our method and tools are demonstrated on a couple of radio-frequency (RF) chips. The multiscale modeling has been verified with infrared temperature measurements.

Published in:

Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on

Date of Conference:

24-26 Sept. 2008

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.