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Jet impingement boiling of a dielectric coolant in narrow gaps

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3 Author(s)
G. M. Chrysler ; IBM Corp., Poughkeepsie, NY, USA ; R. C. Chu ; R. E. Simons

An experimental investigation into the effect of the chip-to-orifice gap was conducted for jet-impingement boiling of FC-72 at the back surface of a 6.5-mm square thermal chip on a 28-mm square ceramic substrate. Four different types of jets were used, all of them employing a single 0.50-mm diameter orifice. A fixed-position jet impingement pin with the orifice centered on a flat face measuring 7.62 mm on an edge was used as a base case. This jet supported a heat flux of about 120 W/cm2 at a reasonable flowrate. Variable-position jet impingement pistons were shown to perform as well as, but no better than the base case. Additional tests were conducted to investigate performance with variation in the chip-to-orifice gap. Thermal performance was found to be insensitive to the gap at large spacing, but below some specific gap it degraded with decreasing gap. A sudden jump in the chip temperature was discovered to occur at a specific gap. This gap length was found to vary with jet flowrate

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:18 ,  Issue: 3 )