By Topic

OCDIMM: Scaling the DRAM Memory Wall Using WDM Based Optical Interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Amit Hadke ; Dept. of Electr. & Comput. Eng., Univ. of California, Davis, CA ; Tony Benavides ; S. J. Ben Yoo ; Rajeevan Amirtharajah
more authors

We present OCDIMM (optically connected DIMM), a CPU-DRAM interface that takes advantage of multiwavelength optical interconnects. We show that OCDIMM has at least three key benefits when compared to alternatives such as FBDIMM (fully buffered DIMM), which is used in products from Sun (U. Nawathe et al., 2008) and Intel. First, replacing the multi-hop store-and-forward network in the FBDIMM architecture by a WDM (wavelength-division multiplexing) based optical interconnect results in significantly lower latency (up to 50% reduction in some configurations). Second, it is scalable to much higher capacities (such as 32 DIMMs per channel) with only a modest degradation in latency. Third, due to the higher data rate of an optical interface and the concurrency offered by multiple wavelengths, OCDIMM offers up to a 90% improvement in memory bandwidth. Most importantly, these benefits can be obtained using off-the-shelf DRAM devices, by making simple modifications to the DIMM circuit board and the memory controller.

Published in:

2008 16th IEEE Symposium on High Performance Interconnects

Date of Conference:

26-28 Aug. 2008