Referenced Items are not available for this document.
This paper discusses the current and future needs in continued CMOS scaling, reviews the status of the transfer and joining (TJ) technology for MCM-D and wafer level 3DI integration, and explores the opportunities of the TJ technology in the realm of the ldquoMore than Moorerdquo era.
Published in:
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Date of Conference: 28-31 July 2008
- Page(s):
- 1 - 10
- E-ISBN :
- 978-1-4244-2740-6
- Print ISBN:
- 978-1-4244-2739-0
- INSPEC Accession Number:
- 10205933
- Conference Location :
- Shanghai
- Digital Object Identifier :
- 10.1109/ICEPT.2008.4606934
- Product Type:
- Conference Publications
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