Referenced Items are not available for this document.
This paper presents thermal analyses of a power amplifier placed in a wind tunnel. All the investigations are based on the transient temperature measurements performed during the circuit cooling process. The measured cooling curves were used to compute the cumulative and differential structure functions for the circuit with a heat sink. These functions helped to determine the optimal values of circuit model parameters necessary for numerical thermal simulations. The experiments demonstrated the influence of the wind speed on the value of the heat transfer coefficient and consequently on the temperature of the entire structure.
Published in:
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Date of Conference: 17-19 Sept. 2007
- Page(s):
- 2 - 5
- Print ISBN:
- 978-2-35500-002-7
- INSPEC Accession Number:
- 9777448
- Conference Location :
- Budapest
- Digital Object Identifier :
- 10.1109/THERMINIC.2007.4451737
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
