Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

A Patterned Dielectric Support Process for High Performance Passive Fabrication

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chen, C.C. ; Nat. Chiao Tung Univ., Hsinchu ; Ssu-Ying Chen ; Cheng, Y.T.

This letter presents a micromachining process to effectively reduce substrate loss via a structure of patterned oxide/nitride fins on a silicon substrate with a resistivity of 1 Omega-cm. Experimental results demonstrate that the insertion loss of a coplanar waveguide (CPW) deposited on the structure can be lowered to the value of 4.33 dB/cm at 40 GHz. Meanwhile, an analytical model is developed to predict the characteristics of the CPW.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:18 ,  Issue: 2 )