By Topic

Wire Bond Challenges of Stacked Dice Devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Vath, C.J. ; ASM Technol. Singapore Pte. Ltd., Singapore ; Srikanth, N. ; Premkumar, J. ; Sivakumar, M.
more authors

The integration of stacked dice into convention packaging formats provides a promising capability in reducing the cost, weight and size of the package while increasing the overall functionality of the system. It has been well accepted as enabling approach for smaller handheld devices such as cellular phones and digital camera. Among the various process steps in the packaging of these devices, wire bonding forms one of the critical processes. It applies a combination of mechanical force, ultrasonic power, and thermal energy to thin and, often, unsupported silicon die. This paper outlines the use of finite element in the design and development of a viable wire bonding approach for the interconnection of stacked dice in packages. We also show how improvements in the wire bonder are made to meet the needs of stacked die packaging.

Published in:

Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International

Date of Conference:

3-5 Oct. 2007