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Ink-jet Printing of Nano Materials and Processes for Electronics Applications

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4 Author(s)
Suganuma, K. ; Inst. of Sci. & Ind. Res., Osaka Univ., Osaka ; Wakuda, D. ; Hatamura, M. ; Kim, K.S.

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ag nanoparticle pastes have been successfully adopted to ink-jet wiring and the multilayered circuit layers in a SiP structure. Ink-jet printing with Ag nano particle pastes demonstrated the potentials of the new printed electronics technology. Lowering process temperature for Ag nanoparticle pastes finally reached room temperature wiring in air atmosphere.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007

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