Referenced Items are not available for this document.
In this study, the effect of epoxy based molding compound packaging on a micro-electro-mechanical system (MEMS) pressure sensor performance is investigated. A series of experiments were conducted to characterize the MEMS sensor over temperature and pressure changes by measuring output voltage signals. The sensor was modeled by a finite element method to investigate the stress developments. The molding compound was assumed as elastic and viscoelastic material to examine the material modeling effect on the calculation results. The model was verified by comparing the calculated results with experimental data. It was found that the stress induced by the molding compound had significant influence on the sensor performance, and the accuracy of the calculations was highly dependent on the modeling of the molding compound. Based on the results, the mechanism of the stress development and its effect on the sensor signal were discussed
Published in:
Components and Packaging Technologies, IEEE Transactions on
(Volume:30
,
Issue:
2
)
Date of Publication: June 2007
- Page(s):
- 285 - 293
- ISSN :
- 1521-3331
- INSPEC Accession Number:
- 9501227
- Digital Object Identifier :
- 10.1109/TCAPT.2007.898360
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 29 May 2007
- Issue Date :
- June 2007
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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