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In this paper, the skin effect for 2-D on-chip interconnections is predicted using a recently developed differential surface admittance concept. First, the features of the new approach are briefly recapitulated and details are given for a conductor with rectangular cross-section. Next, the 1-D situation is studied as a limiting case of the 2-D situation. The relationship with a local impedance formulation is investigated and illustrated with a numerical example. Finally, the new method is used to determine inductance and resistance matrices of 2-D on-chip interconnect examples with specifications taken from the international technology roadmap for semiconductors. Extra capacitance data are also provided.