By Topic

AeroMEMS Wall Hot-Wire Anemometer on Polyimide Substrate Featuring Top Side or Bottom Side Bondpads

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

Design, manufacturing, calibration, and basic characterization of a microelectromechanical systems (MEMS) wall hot wire sensor on a flexible polyimide substrate are presented. A configuration exhibiting bond pads on the top side of the foil, as well as an improved setup featuring a through-foil metallization and bottom side bond pads were established. Both sensor designs make use of a highly sensitive nickel thin-film resistor spanning a reactive ion etched cavity in a polyimide substrate. The polyimide base material enables the sensor to be adapted to curved aerodynamic surfaces, e.g., airfoils and turbine blades. A mismatch of curvature of aerodynamic surface and silicon sensor surface, as observed with previously presented MEMS hot-wire anemometers is avoided. The combination of polyimide's low thermal conductivity and a cavity featuring FEM-optimized dimensions accounts for a very low-power consumption (<25 mW). Fluctuations in wall shear stress up to 85 kHz can be resolved in constant-temperature mode. An average sensitivity of 0.166 V/(N/m2) is achieved in a wall shear stress range from 0 to 0.72 N/m2. The specifically designed through-foil metallization process allows for electrical contacts to be positioned on the backside of the substrate, thus effectively minimizing aerodynamic disturbances.

Published in:

IEEE Sensors Journal  (Volume:7 ,  Issue: 8 )