Scheduled System Maintenance:
On May 6th, system maintenance will take place from 8:00 AM - 12:00 PM ET (12:00 - 16:00 UTC). During this time, there may be intermittent impact on performance. We apologize for the inconvenience.
By Topic

On The Problem of Using Guard Traces for High Frequency Differential Lines Crosstalk Reduction

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
3 Author(s)
Mbairi, F.D. ; Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Stockholm ; Siebert, W.P. ; Hesselbom, H.

In this paper, the problem of using guard traces for reducing crosstalk between differential transmission line pairs is investigated, both experimentally and by full-wave electromagnetic (EM) simulations. Different cases of differential lines crosstalk are treated with and without guard trace separation between the differential line pairs. Coated microstrip printed circuit board test structures including thru-reflect-line calibration standards are designed and fabricated on a high frequency laminate material, allowing direct measurement of crosstalk between adjacent differential line pairs in the absence and in the presence of guard traces stitched with vias of regular spacing. The test structures are characterized with mixed-mode scattering parameters using a physical layer test system. Different configurations (of differential line pairs) without guard trace, with floating guard traces (which are terminated and nonterminated) and with a solid guard trace separation are investigated using a High Frequency Structure Simulator (a commercial full-wave 3-D EM simulation tool). The experimental data are compared with the simulation results, and some conclusions and guidelines on the effect of guard traces for alleviating crosstalk between differential transmission lines are presented

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:30 ,  Issue: 1 )