By Topic

Modelling and Handling Seams in Wide-Area Sensor Networks

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Newman, J. ; Inst. for Comput. Graphics & Vision, Graz Univ. of Technol., Graz ; Schall, G. ; Schmalstieg, D.

The fields of wearable computing, augmented reality and ubiquitous computing are in principle highly convergent, as they all promise a Utopian future in which the devices embedded in the environment, our bodies and our clothes will have reached a level integration such that we can intuitively perceive and interact with our environment. However, the reality as practised in research labs and limited commercial deployments has been that budgetary and technical constraints have actually kept these fields separate and distinct. One manifestation of this separation is in the choice of sensors used to build systems in each domain. A truly cross-disciplinary project has to incorporate sensors of much greater heterogeneity than has occurred heretofore. The way in which sensors are deployed results in spatial seams that can act as obstacles to the provision of services across different areas. This paper takes an architectural approach to handling events from different tracking systems and maintaining a consistent spatial model of people and objects. The principal distinguishing feature is the automatic derivation of dataflow network of distributed sensors, dynamically and at run-time, based on requirements expressed by clients.

Published in:

Wearable Computers, 2006 10th IEEE International Symposium on

Date of Conference:

11-14 Oct. 2006