Referenced Items are not available for this document.
In Bluetooth systems, the requirements for the front-end modules are that they have to be compact and cost-effective. Yet the band pass filter often occupies a relatively large size compared to the other components within the RF module. In this paper, a compact realization of an ISM bandpass filter suitable for system-in-a-package (SiP) applications, which utilizes a novel meander configuration, is introduced. To reduce the fabrication cost, the miniaturized filter is implemented on a standard organic material (FR-4) instead of on ceramic substrates (Awai, 2000)
Published in:
Electronics Systemintegration Technology Conference, 2006. 1st
(Volume:2
)
Date of Conference: 5-7 Sept. 2006
- Page(s):
- 802 - 804
- E-ISBN :
- 1-4244-0553-x
- Print ISBN:
- 1-4244-0552-1
- INSPEC Accession Number:
- 9231644
- Conference Location :
- Dresden
- Digital Object Identifier :
- 10.1109/ESTC.2006.280103
- Product Type:
- Conference Publications
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