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Study of Ultrasonic Power Parameter on the Large Aluminum Wire Wedge Bonding Strength

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3 Author(s)
Wang Fu-liang ; Coll. of Mech. & Electronical Eng., Central South Univ., Changsha ; Han Lei ; Zhong Jue

During the large aluminum wire wedge bonding experiments, the PZT driver signal and the bonding shear strength was acquired as the indicator of ultrasonic power and bonding strength respectively. With those data, the relationship between ultrasonic and bonding strength was studied. The experiments result shows that in this paper's research condition: 1) the ultrasonic power were effected by ultrasonic power ratio and other uncontrolled factors such asymmetric substrate quality, unstable restrict between wedge tool and aluminum wire and so on; 2) when ultrasonic power less than LOW, increase power will increase the bonding strength and decrease the fail bonding; on the contrary, when ultrasonic power greater than 1.6W, increase power will decrease the bonding strength and increase the fail bonding; only when ultrasonic power between LOW and 1.6W, can stable and high yield bonding be reached

Published in:

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Date of Conference:

27-29 June 2005