By Topic

Elastic properties measurement of glass layers fabricated on silicon wafers for microelectronics and micromachines

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Tsukahara, Y. ; Tech. Res. Inst., Toppan Printing Co. Ltd., Saitama, Japan ; Ohira, K. ; Yanaka, M.-A. ; Inaba, M.
more authors

Elastic properties such as the Young's modulus, the Poisson's ratio and the density of Si-B-O glass layers fabricated on [100] silicon substrates by the flame hydrolysis deposition method were measured. Thicknesses of the layers were about 20 /spl mu/m. It was found that the Young's modulus decreased with the boron dopant concentration. The Poisson's ratio was about 0.26 regardless of the boron dopant concentration. The measured elastic properties will be used in the design of micromachines fabricated with silicon substrates and glass layers.<>

Published in:

Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on  (Volume:42 ,  Issue: 3 )