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Browse Journals & Magazines > Components, Packaging, and Ma ...> Volume:18 Issue:1 Help

Electrical design of an MCM package for a multi-processor digital system

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5 Author(s)
Sarfaraz, A. ; IBM Microelectronics, East Fishkill, NY, USA ; Swaminathan, M. ; Crocker, Jim ; Bhatia, H.
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The electrical design of a Ceramic Multichip Module (MCM-C) CPU node for a multiprocessor parallel system has been presented. The electrical performance of the package has been evaluated through modeling and simulation using models that provide both qualitative as well as quantitative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation. Details on the techniques used to optimize the MCM package have also been explained in this paper

Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication: Feb 1995

Page(s):
127 - 143
ISSN :
1070-9894
INSPEC Accession Number:
4898229
Digital Object Identifier :
10.1109/96.365499
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Feb 1995
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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