Scheduled System Maintenance:
On May 6th, single article purchases and IEEE account management will be unavailable from 8:00 AM - 5:00 PM ET (12:00 - 21:00 UTC). We apologize for the inconvenience.
By Topic

Low dielectric constant multilayer glass-ceramic substrate with Ag-Pd wiring for VLSI package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Shimada, Y. ; Mater. Dev. Center, NEC Prefecture, Tokyo, Japan ; Yamashita, Y. ; Takamizawa, H.

Glass-ceramic materials with low dielectric constant, which can be sintered at about 900° in air, have been developed. Conductors with extremely low electrical resistivity due to silver and palladium particle shape control have been obtained. The electrical design must be considered for the packaging substrate. Pulse transmission properties are influenced greatly by the kinds of ground planes and wiring planes used. Therefore, basic pulse-transmission properties, such as propagation delay, characteristic impedance, and crosstalk coupling noise, were measured for various multilayer structures. Technologies that allow precise control of substrate properties have been established. Characteristics for the multilayer glass-ceramic (MGC) substrate are summarized. It is shown that the low-dielectric-constant MGC substrate, with silver-palladium conductors, can be applied to VLSI multichip packaging substrate for use in large-scale computer systems

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:11 ,  Issue: 1 )