The shape modifications observed on the edges of openings formed by a double-sided etch when etched past the breakthrough point are described. A method for predicting the overetching effects of such shapes is described. The implications that the results have on dimensional control of beams and orifices utilized in some micromachined silicon devices are also discussed. Orifices with relatively straight walls can be etched through
Published in:
Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE
Date of Conference: 6-9 June 1988