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Mechanisms of anodic bonding of silicon to pyrex glass

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3 Author(s)
Albaugh, K.B. ; IBM Gen. Technol. Div., Essex Junction, VT, USA ; Cade, P.E. ; Rasmussen, D.H.

The mechanisms of formation of anodic bonds between glasses and metals are examined. The process is found to be an electrochemical analog to thermal glass-to-metal seals, where the metal surface is oxidized into the glass due to the development of large electric fields across the anodic depletion layer. The current vs. time transient at constant voltage contains a significant amount of information regarding the process mechanisms, which are predominantly electrochemical.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Date of Conference:

6-9 June 1988

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