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Processing conditions for polysilicon films with tensile strain for large aspect ratio microstructures

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9 Author(s)
Guckel, H. ; Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA ; Burns, D.W. ; Tilmans, H.A.C. ; Visser, C.C.G.
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The processing conditions to obtain high-quality and repeatable polysilicon films are described. These include substrate preparation, the deposition procedure, reactor configuration, and postdeposition treatment. Examples of large-aspect-ratio microstructures such as long, thin beams and tuning forms for sensor applications and large-area diaphragms for piezoresistive microphones and X-ray masks are presented to illustrate the potential of polysilicon films that are in tension.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Date of Conference:

6-9 June 1988