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Statistics of solder joint alignment for optoelectronic components

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4 Author(s)
J. McGroarty ; Dept. of Mater. Sci. & Eng., Cornell Univ., Ithaca, NY, USA ; P. Borgensen ; B. Yost ; C. -Y. Li

The use of an area array of solder joints allows the self-alignment of a large number of components in microelectronic packages. The sensitivity to statistical variations in solder joint volumes is investigated. The analysis shows that sufficiently large arrays of randomly distributed volumes lead to very narrow distributions in the height and tilt of one component relative to another

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:16 ,  Issue: 5 )