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Surface micromachined polysilicon accelerometer

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5 Author(s)
Ristic, Lj. ; Motorola Inc., Phoenix, AZ, USA ; Gutteridge, R. ; Dunn, B. ; Mietus, D.
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A surfaced micromachined polysilicon accelerometer is designed and manufactured. The sensing element represents a differential capacitor comprised of three polysilicon layers. The structure is made such that the seismic mass (polysilicon layer 2) is movable while the other polysilicon layers (layers 1 and 3) are nonmovable (fixed). The seismic mass is centered between the two fixed layers, thereby creating a differential capacitance: the bottom capacitance being formed between polysilicon layers 1 and 2, and the top capacitance being formed between polysilicon layers 2 and 3. The sensitive axis of the structure is in the direction perpendicular to the surface of the substrate. The device can be used with a signal processing circuit configured as an open loop system to achieve a sensitivity of 0.35 mV/g/V.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1992. 5th Technical Digest., IEEE

Date of Conference:

22-25 June 1992

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