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Accurate measurement of high-speed package and interconnect parasitics

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6 Author(s)
Carlton, D.E. ; Cascade Microtech Inc., Beaverton, OR, USA ; Gleason, K.R. ; Hopkins, R. ; Jones, J.
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Various ideal structures such as small resistors, shorts, and transmission lines are used to verify the calibration of the measurement instrument at the probe tip. Typical measurements of package and interconnect performance are demonstrated, and sample measurements are made, including time domain reflectometry, propagation delay, isolation, and bypassing of power lines. Measurement results are shown

Published in:

Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988

Date of Conference:

16-19 May 1988

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