Referenced Items are not available for this document.
The bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors is reported. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +or-2 mu m. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions.<
Published in:
Photonics Technology Letters, IEEE
(Volume:4
,
Issue:
12
)
Date of Publication: Dec. 1992
- Page(s):
- 1369 - 1372
- ISSN :
- 1041-1135
- INSPEC Accession Number:
- 4371037
- Digital Object Identifier :
- 10.1109/68.180579
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec. 1992
- Sponsored by :
- IEEE Photonics Society
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