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Micro impact characterisation of solder joint for drop impact application

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7 Author(s)
Wong, E.H. ; Inst. of Microelectron., Singapore ; Mai, Y.-W. ; Rajoo, R. ; Tsai, K.T.
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Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests, endorsing high speed shearing as a viable quality assurance test for manufacturing and incoming inspection. The high speed shear characteristics of solder joints under different test conditions (shear speed, shear angle, and temperature) and aging conditions (multiple reflow, temperature humidity, and salt spray) have been evaluated. Preliminary S-N characteristic for SnPb_OSP and SnAg_OSP solder joints have been generated using high speed cyclic bends test. These could be devolved into a life prediction model for board level solder joints in product drop impact

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Electronic Components and Technology Conference, 2006. Proceedings. 56th

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