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Reliability analysis of embedded chip technique with design of experiment methods

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4 Author(s)
Xiuzhen Lu ; Key State Lab for New Displays & Syst. Integration, Shanghai Univ., China ; Liu Chen ; Zhaonian Cheng ; Johan Liu

This paper presents reliability and failure analysis of embedded components on the liquid crystalline substrate. First, a demonstration module for embedded technology is fabricated. Then it is put into thermal cycling to find out the most obvious failure. 3D FEM analysis is employed to investigate the failure mode. A design of experiment method is conducted to obtain the optimal structure of embedded chip components.

Published in:

Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on

Date of Conference:

11-14 Dec. 2005

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