Referenced Items are not available for this document.
With MOSFET scaling, increased design complexity, and multiple system power domains, ESD failures occur in internal core areas which are not connected to external package pins. A review of the various internal core device failure mechanisms and design recommendations are presented.
Published in:
System-on-Chip for Real-Time Applications, 2005. Proceedings. Fifth International Workshop on
Date of Conference: 20-24 July 2005
- Page(s):
- 47 - 53
- Print ISBN:
- 0-7695-2403-6
- INSPEC Accession Number:
- 8652228
- Digital Object Identifier :
- 10.1109/IWSOC.2005.58
- Product Type:
- Conference Publications
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