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System-in-package (SiP) is based on the concept of combining all the electronic requirements of a system into a single package. Along with providing cost and size benefits, SiP with an integrated antenna can help mitigate the feed network losses and phase errors in an antenna array based application. This paper presents the development of a low cost, compact RF front end SiP solution for X-band. A printed antenna is integrated with a multilayer BGA package using low cost laminate substrates. This active antenna module can be further integrated into arrays and used for wireless as well as sensing applications.
Date of Conference: 12-17 June 2005