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Demands for increasing power density and levels of functional integration in switch-mode power converters require power electronics manufacturers to develop innovative packaging solutions for power semiconductor devices and modules. Three-dimensional (3-D) packaging techniques offer the potential of lower resistance, higher current handling capability, smaller volume, better thermal management capability, and high reliability. In this paper, we present the constructions and some electrical and thermomechanical analyses of four 3-D packaging approaches that have been developed within the Center for Power Electronics Systems—an NSF Engineering Research Center.
Date of Publication: Aug. 2005