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A three-dimensional neural recording array

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2 Author(s)
Hoogerwerf, A.C. ; Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA ; Wise, K.D.

The authors describe a three-dimensional recording array for the high-density monitoring of neural activity throughout a volume of cortical tissue. The microassembly techniques used permit multiple multishank planar probes to be precisely configured to form 3D microstructures with probe spacings of 100 mu m or less. The probes are aligned through an orthogonal platform, also formed by silicon micromachining. High-density lead transfers between the probes and the platform are formed by selective electroplating and offer very low values of series resistance and shunt capacitance, with center-to-center lead spacings of 100 mu m or less. A 4*4 shank passive probe array has been found to penetrate pia arachnoid easily and is well accepted by the neural tissue. These assembly techniques also appear to be compatible with a variety of other microelectromechanical systems where 3D structures are required.<>

Published in:

Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on

Date of Conference:

24-27 June 1991