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The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wire-length. However, wire congestion and thermal issues are exacerbated due to the compact nature of these layered technologies. In this paper, we develop techniques to reduce the maximum temperature and wire congestion of 3D circuits without compromising total wirelength and via count. Our approach consists of two phases. First, we use a multi-level min-cut placement with a modified gain function for local wire congestion and dynamic power consumption reduction. Second, we perform simulated annealing together with full-length thermal analysis and global routing for global wire congestion and maximum temperature reduction. Our experimental results show smooth tradeoff among congestion, temperature, wirelength, and via.