By Topic

A die-scale micromachining process for bulk PZT and its application to in-plane actuators

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Tao Li ; Eng. Res. Center for Wireless Integrated Syst., Michigan Univ., Ann Arbor, MI, USA ; Gianchandani, Y.B.

Bulk ceramics (including PZT) are important materials for electronic and microsystem packaging or device applications, but they are usually difficult to pattern lithographically. A fabrication process combining lithography, electroplating, batch mode micro electro-discharge machining (μEDM) and batch mode micro ultrasonic machining (μUSM), LEEDUS, has been developed to provide die-scale pattern transfer capability from lithographic masks onto ceramics, glass or other brittle materials. A related process (SEDUS) uses serial μEDM and omits lithography. Feature sizes of 25 μm have been micromachined on the glass-mica (Macor™) ceramic plate with a 4.5×4.5 mm2 die size, 34 μm cutting depth, and 18 μm/min machining rate. As a demonstration an octagonal spiral shaped in-plane actuator was fabricated from bulk PZT using this process. A device of 20 μm thickness and 450 μm × 420 μm footprint produces a displacement of ∼2 μm at 40 V.

Published in:

Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on

Date of Conference:

30 Jan.-3 Feb. 2005