Etch chamber condition-based process control model for shallow trench isolation trench depth control

This paper discusses the development and implementation of an etch chamber condition-based process control model for shallow trench isolation (STI) trench depth (TD) control The novel aspects of the controller are discussed, including PM cycle-based tuning, and measures for excursion protection. The implementation has eliminated the need for manual process recipe adjustment and improved process capability by approximately 30%. Actual process data from pre- and post-implementation demonstrate the efficacy of the proposed approach