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Constitutive modeling of lead-free solders

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2 Author(s)
Pei, M. ; Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Qu, J.

Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on

Date of Conference:

16-18 March 2005

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