Referenced Items are not available for this document.
The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat sinks for desktop computers and electronic devices. This would be suitable for either OEM or aftermarket heat sinks if the thermal resistance can be similar to the state of the art aluminum and copper finned heat sinks.
Published in:
Device and Materials Reliability, IEEE Transactions on
(Volume:4
,
Issue:
4
)
Date of Publication: Dec. 2004
- Page(s):
- 638 - 640
- ISSN :
- 1530-4388
- INSPEC Accession Number:
- 8276496
- Digital Object Identifier :
- 10.1109/TDMR.2004.836731
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 31 January 2005
- Issue Date :
- Dec. 2004
- Sponsored by :
- IEEE Electron Devices Society
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