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Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution

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3 Author(s)
K. Shakeri ; Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; M. Bakir ; J. D. Meindl

An ultralow inductance I/O interconnect, called a coaxial polymer pillar (CoPP) is introduced that is compatible with sea of polymer pillars (SoPP) recently presented. Polymer pillars are highly process-integrated and mechanically flexible (compliant) electrical-optical I/O interconnections that mitigate thermomechanical expansion mismatches. The 100x smaller parasitic inductance of the CoPP (in the range of 0.1 pH) compared to the inductance of a solder bump or a regular polymer pillar makes it an excellent I/O interconnect technology for power distribution. The density of CoPPs may exceed 105/cm2.

Published in:

SOC Conference, 2004. Proceedings. IEEE International

Date of Conference:

12-15 Sept. 2004