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Innovative circuit board level routing designs for BGA packages

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3 Author(s)
Titus, A. ; Univ. of Buffalo, NY, USA ; Jaiswal, B. ; Dishongh, T.

Advances in the performance of electronic devices have resulted in high input/output counts both at the chip and the package level, which has led to the development of new packaging technologies that can accommodate these high counts. This paper presents and analyzes a novel method for the placement of ball grid array (BGA) bonding pads and routing wires on printed circuit boards to maximize signal density, which ultimately reduces the number of circuit board layers needed for routing. This method has been termed as the "balls shifted as needed" method and all the ball placement/trace routing designs shown in this paper are based on this method. We also present a performance metric defined as the number of balls routed out divided by the area of package footprint on the circuit board, and we compare various placement/routing schemes using this method.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:27 ,  Issue: 4 )

Date of Publication:

Nov. 2004

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