By Topic

Innovative circuit board level routing designs for BGA packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Titus, A. ; Univ. of Buffalo, NY, USA ; Jaiswal, B. ; Dishongh, T.

Advances in the performance of electronic devices have resulted in high input/output counts both at the chip and the package level, which has led to the development of new packaging technologies that can accommodate these high counts. This paper presents and analyzes a novel method for the placement of ball grid array (BGA) bonding pads and routing wires on printed circuit boards to maximize signal density, which ultimately reduces the number of circuit board layers needed for routing. This method has been termed as the "balls shifted as needed" method and all the ball placement/trace routing designs shown in this paper are based on this method. We also present a performance metric defined as the number of balls routed out divided by the area of package footprint on the circuit board, and we compare various placement/routing schemes using this method.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:27 ,  Issue: 4 )