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Theoretical analysis of RF performance of anisotropic conductive adhesive flip- chip joints

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3 Author(s)
Gang Zou ; Center, Chalmers Univ. of Technol., Goteborg, Sweden ; Gronqvist, H. ; Johan Liu

The RF performance of a single flip-chip joint using anisotropic conductive adhesive (ACA) was modeled using three-dimensional finite difference in time domain (FDTD) methodology. The effects of the number, the distribution of ACA conductive particles, as well as the ACA resin, on RF transition of the joint were studied. The results show that the number and the distribution of conductive particles as well as the adhesive resin have limited influence on the RF performance of an ACA flip-chip joint. Based on the FDTD simulation results, an equivalent circuit model of a single ACA flip-chip joint was also proposed.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:27 ,  Issue: 3 )

Date of Publication:

Sept. 2004

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