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Damascene tungsten process for local interconnects with improved reliability performance

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5 Author(s)
Chapple-Sokel, J. ; IBM Microelectron. Div., Essex Junction, VT, USA ; Phelps, R. ; Krywanczyk, T. ; Sanetra, C.
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Improved functional reliability is demonstrated through implementation of a tungsten damascene process for creating local interconnects that results in a cleaner, more planar surface. Reduction in lateral shorts is posited as the driver for the substantial reduction in yield loss and failure following stress conditions.

Published in:

Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Date of Conference:

4-6 May 2004

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