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Polymer flip-chip bonding of pressure sensors on flexible Kapton film for neonatal catheters

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5 Author(s)
Chunyan Li ; Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA ; Sauser, F.E. ; Azizkhan, R. ; Ahn, C.H.
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A new polymer flip-chip bonding method on a flexible Kapton film has been developed and applied to dual lumen neonatal catheters integrated with silicon micro pressure sensors. This polymer flip-chip bonding technique requires a low temperature process, which is very desirable for mounting microsensors or microactuators on flexible polymer substrates for medical applications. The silicon micro pressure sensors, which are mounted on a flexible Kapton film with metal lines for neonatal catheter, have been fully characterized in both gas and liquid.

Published in:

Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)

Date of Conference:

2004

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