Multi-layer electroplated micro-spring array for MEMS probe card

A MEMS probe card consisting of micro-springs arranged in 250-/spl mu/m-pitch array has been presented. Three-dimensional 'S shape' spring structure was designed and fabricated directly on a circuit board by a newly developed multi-layer Ni electroplating process. Mechanical properties of the micro-springs were measured and no fracture or deformation were found after applying force of 10 mN for 10,000 times. Low force electric contacts to Al or Cu electrodes were obtained with the help of the fritting process.