By Topic

Localized induction heating solder bonding for wafer level MEMS packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hsueh-An Yang ; Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Mingching Wu ; Weileun Fang

This paper reports a new solder bonding method for the wafer level packaging of MEMS devices. The electroplated magnetic film was heated up using the induction heating, and leaded to solder reflow. It took only several seconds to complete the solder reflow and bonding process. The measurement results showed that the temperature of device region was only 110°C during heating. Due to the solder reflow and electroplating technique, hermetic seal of the packaged device is achieved. The bonding strength is up to 18 MPa. In addition, the electroplated thick film also performed as a spacer. In applications, the integration the MUMPs devices with the proposed packaging techniques were demonstrated.

Published in:

Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)

Date of Conference: