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This paper presents the dependence of fracture toughness, fracture strength, and fracture behavior, such as crack propagation, on the crystal orientation of single-crystal silicon. We conducted on-chip tensile testing to measure fracture strength and fracture toughness of single-crystal silicon films with  and  surface in the <100> and <110> loading direction. The loading direction had a significant effect on fracture toughness, which was 2.17 MPa√m in the <100> direction and 1.27 MPa√m in <110>. However, the fracture stress varies with both loading direction and surface orientation. We observed a fracture specimen on which a  cleavage plane eventually appeared on any crystal types of the specimen.