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Effect of crystal orientation on fracture strength and fracture toughness of single crystal silicon

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6 Author(s)
Ando, T. ; Dept. of Micro Syst. Eng., Nagoya Univ., Japan ; Xueping Li ; Nakao, S. ; Kasai, T.
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This paper presents the dependence of fracture toughness, fracture strength, and fracture behavior, such as crack propagation, on the crystal orientation of single-crystal silicon. We conducted on-chip tensile testing to measure fracture strength and fracture toughness of single-crystal silicon films with [100] and [110] surface in the <100> and <110> loading direction. The loading direction had a significant effect on fracture toughness, which was 2.17 MPa√m in the <100> direction and 1.27 MPa√m in <110>. However, the fracture stress varies with both loading direction and surface orientation. We observed a fracture specimen on which a [111] cleavage plane eventually appeared on any crystal types of the specimen.

Published in:

Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)

Date of Conference:

2004