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This paper outlines the recent power devices developments in the maturation of a SiC power MOSFET technology, focusing attention on device structure and performance trade-offs. Improvements will be made on the gate width, gate oxide thickness, doping concentration of the polysilicon gate and overlap spacing of existing silicon carbide MOSFET designs. The success of this design will impact power applications in the areas related to high temperature and high voltage. In the on state, the specific on-resistance is 130 mΩ/cm2. The specific on-resistance of 6H-SiC MOSFET is lower than any others due to the field effect mobility of 35 cm2/Vs.