By Topic

Temperature dependence of surface breakdown on printed circuit board

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Boxue Du ; Dept. of Electr. Eng., Tianjin Univ., China

In this paper, surface breakdown phenomenon of printed circuit board was investigated with increasing temperature from 23°C to 150°C, and decreasing the atmospheric pressure from 100 kPa to 1 kPa. The experiment was carried out by 30 kV DC pulse voltage with the frequencies in the range of 50 Hz to 150 Hz. Printed circuit boards of epoxy resin laminate have been employed to investigate the effects of the low pressures, surface temperatures, electric stress and the frequencies of applied voltage on the discharge quantity. The study revealed that the times to breakdown decrease with increasing temperatures, frequencies and the magnitude of electrical field. The characteristics of discharge currents with increased temperature and the electric stress were discussed by power spectral density. The results show that the power spectral density of discharge currents increases with increasing the temperature, and increases with increasing the electric stress.

Published in:

Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Technology Conference, 2003. Proceedings

Date of Conference:

23-25 Sept. 2003